Mask Alignment System – EVG 620 Mask Aligner

UV exposure for photolithography using a mercury vapor lamp

• Lamp power: 350 W
• Optional wavelength filters
• Exposure Mode
• Proximity
• Soft- and Hard Contact
• Vacuum Contact
• Structure resolution: ≤ 2 µm (Proximity)
• Casette system for different substrate sizes: 3", 4", 150 mm

UV-Nanoimprint-Lithography (UV-NIL) witch stamp possible

• Structure resolution ≤ 50 nm
• Exposure modes: Soft- and Vacuum-Contact

3D Laser Lithography System – Nanoscribe Photonic Professional GT

Laser

• Erbium doped ultrashort pulse fiber laser
• λ = 780 nm; P = 140 mW; Pl = 91 fs; RR = 80 MHz

Drives

• Linear actuator
• Travel path: 10 x 12 cm²
• Feed rate: up to 500 µm/s
• Piezo drive
• Travel path: 300 x 300 µm²
• Feed rate: up to 1000 µm/s
• Galvanoscanner
• Processing area: 200 x 200 µm ²
• Feed rate: up to 200 mm/s
• Writing performance
• Line width: 120 nm (single lines)
• Complete 3D structure creation

Low pressure plasma system – Diener Electronic Pico

System for reactive ion etching

• 40 kHz Alternator
• Power 0 - 230 W
• Two Mass Flow Controllers
• Pressure control range 0.01 - 1 mbar

Available Gases

• Tetrafluormethan CF4
• Sulphur hexafuoride SF6
• Oxygen O2
• Additional gases are possible

Applications

• Anisotropic etching of PMMA to produce optical components
• Anisotropic etching of SiO₂

Sputter Coater – Leica EM SCD500

• Sample size of fragments up to 3 inches
• Layer thickness measurement using quartz crystal
• Planetary gear to avoid shadow effects
• Available materials: Gold, Chrome and Tungsten

Sputter Coater – Tectra SPUCO

• Thermal evaporation
• Electron beam vaporization
• Sample size from fragments up to 3 inch wafers
• Layer thickness measurement using quartz crystal

Spin Coater – Sawatec SM-180-BT

• Sample size of fragments up to 6 inches
• Rotation feed rate up to 10.000 rpm
• 24 segments adjustable per spin operation
• Semi-automatic photoresist dispensing system

Dip Coater – MTI WPTL5-0.01

• Completely programmable
• Acquisition of up to two samples and five coating materials
• Temperature chamber
• Sample dip travel path: up to 80 mm
• Dip feed rate: 1 - 200 mm/min

Precision Picoliter Liquid Dispenser – Sonoplot Gix Microplotter II

Precise Picoliter Dispenser System

Liquid absorption by pure capillary force

• Depostion volume > 0.6 pL
• Suitable for liquids with a viscosity between 0 and 450 cP

Ultrasonic controlled contactless liquid deposition

• Structure sizes from 5-200 µm

Positioning with XYZ linear drives

• Processing area: 35 x 30 x 7 cm
• Positioning accuracy: 5 µm

CAD supported creation of simple and complex structures

Calibration gas generator – QCAL Vapor Calibrator

Gas mixture production

• Principle of pressure saturation According to DIN EN ISO 6145-9, VDI 3490-13
• 2-stage system with saturator and capacitor
• For targeted evaporation of liquids and solids with vapour pressure > 0.005 mmHg (20°C)

e.g. for sensitivity investigations of gas sensors

Variable setting of the analyte concentration during runtime

• From the volume percentage range down to the lower ppm range (< 1ppm)

Variable carrier gas (usually nitrogen)

Temperature and Climate Test Cabinet – Weisstechnik WKL34

Temperature test: -40 - +180 °C

Temperature change:

• Heating: 5.0 K/min
• Cooling: 3.5 K/min

Temperature deviation:

• Time: ±0,3 - ±1,0 K
• Spatial: ±0,5 - ±2,0 K

Humidity range: 10 % - 98 % r.h.

Humidity deviation: ±1 - ±3 % r.h.

32-Bit-S!MPAC* control

3.5"TFT colour touch panel

psychometric humidity measuring system

USB and Ethernet interface

Sample preparation & post-processing

• Precision Saw
• Grinding & Polishing
• Embedding equipment

Laser power meters – GENTEC-EO

Devices and measuring heads for determining the average laser power, pulse energy and stability

• Measuring device: MAESTRO
• Measuring device: U-LINK
• Measuring heads for various power classes (<6 W to 250 W)

Atomic force microscope – Bruker Dimension Icon

• Scan range: 90 x 90 x 10 µm³
• X-Y position noise: 0,10 nm
• Z sensor noise: 35 - 50 pm
• Sample size: ∅210 x 15 mm³
• Acoustic isolation of the environment of up to 85 dB
• Drift rates < 200 pm per minute for instant distortion-free images
• Background noise < 30 pm due to closed-loop performance
• Simultaneous imaging between nanomechanical properties and topography of the sample
• Working range: 1 MPA - 50 GPA for module and 10 pN to 10 µN for adhesion
• Electrical characterization
• Nanomanipulation
• Temperature analyses on samples form -35° C - +250° C

Scanning electron microscope – LOT-QuantumDesign Phenom Pro X

• Magnification: 120x - 100.000x
• Field of View: 2 mm - 2.7 µm
• Resolution: 25 nm (7*7 Pixel)
• Image loading time < 30 Sekuden
• EDX element detection
• Carbon (C/6) to americium (Am/95)
• Samples up to ∅ 25 mm
• Chargereduction for non-conductors
• Tilt & Rotation for tilting angles up to 45°
• Cooling Stage for temperatures from -25 °C to +25 °C

Raman microscope – WITec alpha300 R

• Capture a full Raman spectrum at each image pixel
• Planar scans in x-y axes as well as depth scans in z-
• Depth profiles and Raman spectra at single points
• Brightfield-, darkfield-, phasecontrast-microscopy and DIC
• Confocal fluorescence microscopy
• Sample size: 120 x 120 mm²

3D Laser Scanning Microscope – Keyence VK-X200

Topographic measurement

• Complex surface profiles
• Surface finisch according to JIS B0601:2201 (Iso 4287:1997)

Analysis of transparent layer thicknesses

Measurement window

• max. 1350 µm x 1012 µm (at 10x)
• min. 90µm x 67 µm (at 150x)
• Up to 400 measuring windows can be combined to form an overall image

Microscope – Keyence VR3200

Topography measurement using the light section method

Macro Mode

• Viewing range max. 24 x 18 x10 mm³
• Height accuracy: ±3 µm
• Lateral accuracy: ±5 µm

Micro Mode

• Viewing area max. 7,6 x 5,7 x1 mm³
• Height accuracy: ±3 µm
• Lateral accuracy: ±2 µm

Measurement and analysis functions

• Profile measurement (height, width, angle, radius)
• Curvature, line roughness (ISO4287:1997)
• Surface roughness (ISO 25178)

Optical 3D Scanner – GOM ATOS Core

• Three-dimensional measurement of components up to 500 mm
• Precise 3D coordinate measurement for form and dimension analysis
• High-resolution polygon meshes (STL) for 3D printing, generative manufacturing and dimensional control
• Combination of a strip light projector and two cameras for complete digitization of an object

Surface measuring instrument – FRT Microprof

Confocal microscope CFM

• Contact-free 3D surface measurement
• Structure, roughness and topography measurement
• Light source LED 505 nm

Chromatic White Light Sensor CWL

• Applicable on almost all surfaces
• Measuring range 25 mm to 300 µm
• Height resolution 250 nm to 3 nm
• Lateral resolution 12.5 µm to 1 µm

White light interferometer – Bruker ContourGT-K

Optical 3D microscope for surface measurement

• Maximum scanning range: >10 mm
• RMS Repeatability: <0.03 nm
• Maximum scanning speed: 47 µm / s
• Sample size: 150 x 150 x 100 mm³
• Sample weight: 4.5 kg
• Sample reflectivity: 0,05 - 100 %
• Sample inclination: 40° (glossy surfaces); 84° (rough surfaces)

Tactile profile meter – Bruker Dektak XT

Tactile surface and profile measurement

• Texture
• Roughness
• Topography
• Repeat accurcy vertical 4Å
• Resolution vertical 1Å
• Step height up to 1 mm
• Measuring range 5 mm
• X/Y Achse 150 mm * 150 mm
• R-Theta-Axis 360°
• Sample up to ∅200 mm
• Sample thickness up to 50 mm

Microscope – Nikon LV100DA-U

Motorized microscope for reflected and transmitted light applications

• Observation procedure:
  • Brightfield
  • Darkfield
  • Polarization
  • Differential interference
  • Incident light fluorescence
  • Two-beam interferometry
• Maximum sample size: 150 x 150 x 38 mm³

Microscope – Leica DM6000

Microscope for Material Sciences

Objectives:

• 5x, 10x, 20x, 50x, 100x
• motorized nosepiece

observation modes

• Brightfield
• Darkfield
• Polarization
• Differential interference contrast

Documentation tube for Leica DFC295 digital camera to capture microscope images

LAS Leica Application Suite (PC software)

Touch-sensitive touch screen (Leica SmartTouch)

Digital microscope – Leica DMV6 a

Microscope for 3D visualization

Special features:

• Tilting stand ±60°
• Motorized table
• 3D recording by z-stack measurements
• Max. x-y measuring range
• Stepless zoom optics

• Horizontal working range: 110 mm x 80 mm
• Working range vertical: approx. 120 mm
• Sample weight max. 2 kg

Accessories: polarization filter, diffuser, transmitted light insert, inclination table

Stereomicroscope – Zeiss Stereo V8

• Stereomicroscope for spatial impression of the samples
• Reflected light microscope for non-transparent workpieces
• 8x stepless zoom
• 2 objectives (0,63 und 2,3)
• Magnification max. 184x
• Apochromatic stereo telescope system
• Recording diameter 76 mm
• LED Ring Light
• Sliding table for flexible positioning
• 1.4 Mega Pixel Camera
• Software with measuring function

Hardness tester – Innovatest FALCON 5000

Determination of hardness according to Vickers (HV), Brinell (HB) and Rockwell (HRA, HRC, HRE)

• Load range 10 g - 250 kg
• Measurement of depth gradients (CHD) possible due to controllable table in x- and y-direction
• Overview camera available for exact setting of impressions
• Fully automatic evaluation by software possible

Tester for hardness measurement according to Shore D and micro Shore D

Materials:

• Suitable for thermoplastics and thermosets
  (not suitable for alastomers → Shore A)

Shore D:

• Minimum sample thickness of 6 mm

micro Shore D:

• Minimum thickness of sample 0.5 mm
• Standard: Barreis company

Accessories:

• Calibration plates

Tensile Testing Machine – Shimadzu EZ-Test LX & AG-Xplus

Universal Test Stand Shimadzu EZ-Test LX

• Backlash-free preloaded ballscrew
• Drive via AC servo motor
• Single column model with test stroke of 920 mm
• Test speed: 0.05 to 1000 mm/min
• 2 kN precision measuring cells for tensile and compressive force measurements
• Automatic self-calibration (tension/compression)

Software functions:

• Automatic determination of sample breaking with Auto-Stop
• Free input of test parameters and test speed
• Choice of strength or stress
• Variable creation of test curves by free input

Universal testing machine Shimadzu AG-Xplus

• Two-column model with a test chamber height of 700 mm
• Test speed: 0.0005 - 3 000 mm/min (brittle materials - rubber)
• Load cells from 0.01 N up to 600 kN for tensile and compression tests

Software functions:

• Data transfer rate of 5 kHz (for brittle materials)
• Automat. Determination of specimen break with Auto-Stop

Typical applications

• Tensile and compression test (optional with extensometer)
• Bending test (3-point, 4-point)
• Pull-off test
• Peel test

Dilatometer – Netzsch DIL 402 Expedis

Apparatus for determining linear expansion over different temperature ranges

• Temperature: T_max = 1150 °C
• Heating rate: 0.001 - 50 K/min
• Sample dimension: ∅ 12 mm, length either 25 oder 50 mm
• Length resolution: 2 nm
• Use of different gas atmospheres possible

Particle measuring device – Retsch Chamsizer X2

• Determination of particle size distribution and particle shape by dynamic image analysis
• Two-camera system according to ISO 13322-2
• Particle size range 0.8 - 5 mm
• Dry dispersion of the sample by compressed air nozzle
• Measuring time 2-3 min

Tribometer – Bruker TriboLab

Universal tribometer for determining mechanical friction and wear properties

System configuration

• Linear actuator
• Stroke: 120mm
• Feed rate: 10 mm/s
• Rotary drive
• 5000 rpm
• Liquid container for permanent lubrication
• Force sensor from 50 mN to 200 N
• Temperature chamber up to 400 °C

Contact angle and drop shape analysis – DataPhysics OCA 25

• Direct dosing system
• Frame rate: 75 fps
• Heating chamber for analysis up to 400 °C
• Tilting device for measuring
  • Progress and retreat angles
  • Roll-off angle
  • Contact angle hysteresis

Optical Coherence Tomography – Thorlabs SD-OCR Callisto

Measuring system for optical coherence tomography (OCT)

• SLD with λ = 930 nm and Δλ = 100 nm
• Axial resolution of 7 µm
• Lateral resolution of 8 µm
• Maximum penetration depth of 1.6 mm

Applications

• Material testing
• Thin layer system (e.g. glued areas on packaging, enemal on ceramics, etc.)
• Inclusions in material
• multilayer systems
• medical technology
• examination of dental prostheses

Ellipsometer – Horiba Smartse

• Characterization of thin layers (also multilayer)
• Spectral range: 450 nm - 1000 nm with different spot sizes
• Measuring time < 1 s - max. 10 s
• Evaluation by ellipsometric odel analysis
• Optical measurement:
  • Refractive index n
  • Extinction coefficient k
• Layer thickness measurement from 2 Å to 20 m (±0,04 %)

Mode Line Spectroscopy – Metricon Model 2010/M

• Refractive index and layer thicknesses of bulk material and thin layers measurable
• Measurable refractive index < 1.8
• Refractive index resolution: 0.003 - 0.0001 (sample dependent)
• Layer thickness resolution: 5 nm
• Wavelengths: 637 nm, 830 nm, 1311 nm, 1548 nm
• optimal TE and TM measurement

Applications:

• Optical characterization of planar optical fibers
• Optical characterization of thin films (photoresists, etc.)
• Measurement of single and double layer systems

Abbe Refractometer – Atago DR-M2

• Measurement of liquids and solids
• Available wavelengths
  • 486 nm (wavelength to determine the Abbe number)
  • 589 nm (standard wavelength)
  • 644 nm (wavelength to determine the Abbe number)
  • 656 nm (wavelength to determine the Abbe number)
  • 810 nm (first optical window)
  • 1300 nm (second optical window)
  • 1550 nm (third optical window)
• Measurable refractive index range from 1.3000 to 1.7100 at 589 nm
• Measuring accuracy ± 0.0002
• IR measurements are possible

Bragg grating characterization– Stratophase SYS:Lab 1 & 2

• Online detection and tracking of reflected wavelengths
• Wavelenngth range
  • 1510 nm - 1590 nm
• Sampling rate: 1 Hz / 2 Hz
• Resolution: 1 pm
• Max. number of sensors: 2 / 4
• Ports: FC/APC
• Touchscreen operation
• Control of fluidic pumps
• Integrated software for online tracking of up to ten reflected wavelengths per sensor
• External fluidic system with 4 pumps of different volumes

Optical measurement technology

• Transmission and reflection
• LED measuring sytem

Laser beam diagnostics

• APE Pulse Check 50
• Prime Polarization Analyzer
• Primes Focus Monitor
• Thorlabs - Shack Hartmann Sensor

Selective laser melting system – EOS M 290

Production of complex structures of metal components directly from CAD files for feasibility studies, prototypes and small series with integrated monitoring system for quality assurance.

Characteristics

• Laserpower: 400 W
• Wavelength: 1070 nm
• Focus diameter: 100 µm
• Scanning speed: max. 7.0 m/s
• Building volume: 250 x 250 x 325 mm³

Materials

• Stainless steel
• Titanium
• Aluminium
• Nickel alloys
• and much more

Selective laser sintering system – EOS FORMIGA P 110

3D printing of fully functional, detailed and biocompatible polymer components.

Characteristics

• Laserpower: 30 W
• Wavelength: 10.6 µm
• Scanning speed: max. 5.0 m/s
• Construction volume: 200 x 250 x 330 mm³

Supported materials

• Polyamide
• Alumide
• PrimeCast® 101
• PrimePart® ST

Hybrid milling and laser melting system – Matsuura LUMEX

• Combination of selective laser sintering (SLS) and high speed milling (HSM)
• This combination reduces both roughness and rework times to a minimum.

Laser

• Laserpower: 50 - 500 W
• Laser beam quality: M² < 1,1
• Wavelength: 1070 nm

Tools

• Spindle speed: 450 - 45.000 min^-1
• Drive power: 4,5 / 2,6 kW
• Number of spindles: 20

Supported metals

• Stainless steel 630 / 316L
• Titanium alloy Ti-6Al-4V
• Cobalt chromium superalloy
• Nickel alloy 718
• AlSi10Mg

Hot isostatic press – Quintus QIH

• Compression of materials (e.g. additive manufactured bodies) at high heat and gas pressure.
• The HIP process produces a density of 100% at a temperature far below the solidus temperature of the specific material.
• Maximum operating pressure: 2070 bar
• Maximum temperature: 1400 °C
• Processing chamber: ∅ 170 mm² x 300 mm

Selective Laser Melting System – Realizer SLM-300i

Processing of tool steel, stainless steel, Ni alloys, Al alloys, titanium, titanium alloys, CoCr alloys and other weldable alloys

Characteristics:

• 1000 W fiber laser
• Accuracy z-direction: 20 - 100 µm
• Platform dimensions: 300 x 300 mm
• Maximum construction height: 300 mm

Integrated sieve station for powder recycling

Modular powder trolley for docking

Selective Laser Melting System – Realizer SLM-50

Processing of tool steel, stainless steel, Ni alloys, Al alloys, titanium, titanium alloys, CoCr alloys and other weldable alloys

Characteristics:

• 100 W fiber laser
• Accuracy z-direction 20 - 50 µm
• Platform Dimension: ∅ 70 mm
• Maximum construction height: 80 mm

3D Printer – Stratasys Fortus 450mc

Fused Deposition Modelling

Processing of standard thermoplastics (ABS), engineering thermoplastics (nylon, PC) and high-performance thermoplastics (Ultem 1010 and 9085)

Characteristics:

• Processing space: 40.6 x 35.5 x 40 cm³
• Support: break-away und wasserlöslich
• Device for two support canisters and model cartridges
• Layer thicknesses: 0.127 - 0.330 nm

Colour and multi-materials 3D printing – Stratasys Objet350 Connex3

Processing of digital ABS, biocompatible plastic, high temperature material, rubber-like material and polypropylene-like material.

Characteristics:

• Processing space: 340 x 340 x 200 mm³
• Layer thickness: 16 - 30 µm
• Processing of up to three materials simultaneously
• Variations:
  • Degrees of hardness
  • Transparency
  • Flexibility
  • Colors
  • Temperature stability