The AG alp pursues three approaches in this area which are based on different laser technologies. On the one hand, these are the application of fiber lasers in continuous wave and pulsed operation for processing ceramics such as aluminum nitride, aluminum oxide and semiconductors such as silicon carbide. The classical machining methods of cutting, drilling and structuring are investigated and optimized for specific applications. In addition, alternative annealing processes to improve the electrical transition between metallic layers and the semiconductor SiC are being researched in the field of silicon carbide. On the other hand, innovative ultrashort pulse technology is also used for material processing, which permits particularly gentle processing due to its short pulse lengths. This applies not only to ceramics and semiconductors but also to superconductors. In addition, water jet guided laser cutting with pulsed laser systems is used to process semiconductors and superconductors in particular.